Technical Area

Domain glossary

Electronic backend vocabulary

Agreed definitions of domain terms to ensure semantic interoperability between participants.

MachineAsymtekDAODispenser

Asymtek dispensing machine. Includes reference to a fluid cabinet (SmartFluidCabinet) through smartfluidcabinet_id. Process: application of adhesives and solder pastes.

MachinePemtronDAOAOI

Pemtron automated optical inspection (AOI) equipment. Captures circuit images to detect soldering defects, component placement issues and paste quality.

MachineVerticalOvenDAOCuring

Vertical curing oven. Defines temperature zones (BufferZoneDAO), number of columns, layout and sorting direction. Process: curing of adhesives and resins.

MachineLoaderDAOTransport

PCB loader. Defines the maximum buffer capacity (max_range). Controls board entry to the production line.

MachineOkNokDAOTest

OK/NOK classification station. Separates conforming from non-conforming products after inspection. Defines maximum buffer capacity (max_range ).

MachineSmartFluidCabinetDAOAuxiliary

Smart fluid cabinet. Has three configurable tanks (left/center/right) with material level, variable codes and associated material.

MachineReviewStationDAOInspection

Manual review station with AOI integration. Allows an operator to review and reclassify automatic inspection results.

MachineSmartInfinityDAOAdvanced AOI

Smart Infinity machine with advanced AOI capabilities. Includes AOI software version (version_of_aoi) and AOI activation flag.

ProcessEventProcess

Inline process action event. Contains an action code (PCB_MACHINE_IN, PCB_MACHINE_OUT, PCB_START_PRODUCTION) and the exact event date.

BufferEventBuffer

Inherits from ProcessEvent. Represents the movement of a product in a line buffer. Adds indexwith the exact position in the buffer.

AlarmEventAlarm

Alarm event. Contains code, message(nullable), startDateand endDate(null if the alarm is still active).

VariableAlarmEventVariable alarm

Inherits from AlarmEvent. Alarm linked to a specific machine variable through variableCode. Indicates that a variable value has gone out of tolerance.

InspectionEventInspection

Inspection event with multiple steps. Each step (InspectionStep) can be successor errorwith a message. Includes Raw or Processed images.

CommandEventCommand

Command sent to a machine. Has lifecycle status: Pending→ Sent→ Processing→ Completed/ Failed/ Timeout.

CommandStatus.PendingStatus

The command has been created in the system but not yet sent to the machine.

CommandStatus.SentStatus

The command has been sent to the destination. Acknowledgement is expected.

CommandStatus.ProcessingStatus

The machine is actively executing the command.

CommandStatus.CompletedStatus

The command completed successfully. The field resultmay contain result data.

CommandStatus.FailedStatus

The command failed during execution. The field errorCodeidentifies the failure type.

CommandStatus.TimeoutStatus

The command did not receive a response in the expected time. Requires manual review.

Data OwnerRole

Legal owner of the data. Decides which data is shared, in what form and under what conditions. Not necessarily the entity that technically publishes it.

Data ProviderRole

Entity exposing data in BACK-X through its Eclipse EDC connector. Publishes datasets from MES systems and backend equipment.

Data ConsumerRole

Consumes data under a usage contract agreed via Eclipse EDC. Strictly respects the Data Owner’s ODRL policies.

Service ProviderRole

Offers services on top of data: advanced analytics, AI/ML models, monitoring or process-optimization services.

Federator / OperatorRole

Operates the multi-tenant BACK-X platform. Defines and enforces governance rules. Assumed by ONIZEA. Does not access data content without an explicit contract.

Clearing HouseRole

Trusted third party that records transactions, contracts and usage evidence. Provides traceability and audit support. To be defined for later phases.

Data dictionary

Data dictionaries

Technical details of all fields in each data product: type, description, value domain and validation rules.

Field	Type	Req.	Description	Example
Event identification
`event_id`	GUID	Yes	Unique event identifier. Corresponds to EventBase.id	`550e8400-e29b-41d4…`
`event_type`	string	Yes	Type discriminator: ProcessEvent, BufferEvent, AlarmEvent, VariableAlarmEvent, InspectionEvent, CommandEvent, MachineEvent	`ProcessEvent`
`created_timestamp`	DateTime	Yes	Event creation timestamp in the source system	`2024-01-15T08:32:11Z`
`updated_timestamp`	DateTime	Yes	Timestamp of last event update	`2024-01-15T08:32:45Z`
Plant context
`line_id`	GUID	Yes	Reference to lines.id. Identifies the production line where the event occurred	`3f8c2d1a-b4e7…`
`line_name`	string	Yes	Descriptive line name (denormalized for queries)	`Backend Line 01`
`machine_line_id`	GUID	Yes	Identifier of the machine instance on the line (MachineLineBase.identifier)	`a1b2c3d4-e5f6…`
`machine_name`	string	Yes	Name of the machine on the line	`Asymtek D-250`
`machine_type`	string	Yes	Machine type derived from BSON discriminator. Values: dispenser, vertical_oven, aoi, loader, unloader, ok_nok, review_station, fluid_cabinet	`dispenser`
Product context
`customer_product_id`	string	No	Customer product ID. Nullable if the event is not associated with a specific product	`CUST-001`
`part_number`	string	No	Product part number	`PN-12345-REV-B`
Specific data: ProcessEvent
`process_code`	string	Cond.	Only present in ProcessEvent and BufferEvent. Action code: PCB_MACHINE_IN, PCB_MACHINE_OUT, PCB_START_PRODUCTION	`PCB_MACHINE_IN`
`event_timestamp`	DateTime	Cond.	Actual moment of the process event (different from created_timestamp)	`2024-01-15T08:30:00Z`
`buffer_index`	int	Cond.	BufferEvent only. Position in the machine buffer	`3`
Specific data: AlarmEvent
`alarm_code`	string	Cond.	Machine alarm code	`TEMP_OUT_OF_RANGE`
`alarm_message`	string	No	Descriptive alarm message. Nullable	`Zone 2 temperature exceeds maximum`
`alarm_start`	DateTime	Cond.	Alarm start	`2024-01-15T09:15:00Z`
`alarm_end`	DateTime	No	Alarm end. Null if the alarm is still active	`2024-01-15T09:42:00Z`
`variable_code`	string	No	VariableAlarmEvent only. Code of the variable that triggered the alarm	`ZONE2_TEMP`
Specific data: InspectionEvent
`inspection_id`	string	Cond.	Unique inspection identifier	`INS-2024-001547`
`inspection_start`	DateTime	Cond.	Inspection start	`2024-01-15T10:00:00Z`
`inspection_steps_count`	int	Cond.	Total number of inspection steps executed	`12`
`inspection_errors_count`	int	Cond.	Number of steps with error result	`2`
Technical metadata
`source_system`	string	Yes	Source system that generated the event	`ProcessTracker v2.1`
`ingestion_timestamp`	DateTime	Yes	Event ingestion moment in BACK-X	`2024-01-15T08:33:00Z`
`version_schema`	string	Yes	Data product schema version	`BACKX.LineMachineEvents.v1`

Field	Type	Req.	Description	Example
Identification
`event_id`	GUID	Yes	Unique event identifier	`b7352f5e-1602-499d-b29d-69f4a3d9ba03`
`data_product_name`	string	Yes	Data product name	`BACKX.PCBManufacturingEvents.InternalRaw.v1`
`schema_version`	string	Yes	Schema version	`1.0.0`
Source system
`source_system.name`	string	Yes	System that originated the event	`AOI`
`source_system.ingestion_timestamp`	DateTime	Yes	Record ingestion moment	`2026-05-07T00:16:11Z`
`source_system.connector_id`	string	Yes	Ingestion connector identifier	`EDC_BACKX_4`
`source_system.tenant_id`	string	Yes	Data logical tenant or customer	`tenant-01`
Event
`event_context.event_type`	string	Yes	Functional event type	`VariableAlarmEvent`
`event_context.process_code`	string/null	No	Process code associated with the event	`BUFFER_OUT`
`event_context.created_timestamp`	DateTime	Yes	Event creation date	`2026-01-12T02:15:47Z`
`event_context.event_timestamp`	DateTime	Yes	Effective event date	`2026-01-12T02:17:50Z`
`event_payload.event_type_specific_payload.synthetic`	boolean	No	Indicates whether the payload is synthetic	`true`
Plant and line
`plant_context.plant_id`	string	Yes	Plant identifier	`PLANT-02`
`plant_context.line_id`	GUID	Yes	Unique line identifier	`61ae2092-6c40-4c6d-b793-f2276c723c27`
`plant_context.line_name`	string	Yes	Production line name	`SMT-Line-8`
`plant_context.machine_line_id`	GUID	Yes	Identifier of the machine within the line	`5e6bd95c-e035-43c3-a399-30e90342c535`
`plant_context.shift_id`	string	No	Production shift	`SHIFT-3`
Product and order
`product_context.customer_product_id`	string	No	Customer product identifier	`CP-67684`
`product_context.part_number`	string	No	Part number	`PN-113331`
`product_context.work_order_id`	string	No	Work order	`WO-2545405`
`product_context.batch_id`	string	No	Manufacturing batch	`BATCH-94828`
`product_context.serial_number`	string	No	Unit serial number	`SN-523938647`
PCB design
`pcb_design_context.product_family`	string	No	PCB product family	`automotive`
`pcb_design_context.board_type`	string	No	Physical board type	`flex`
`pcb_design_context.layer_count`	int	No	Number of layers	`6`
`pcb_design_context.pcb_thickness_mm`	float	No	PCB thickness in millimeters	`2.0`
`pcb_design_context.surface_finish`	string	No	Surface finish	`ENIG`
`pcb_design_context.min_track_width_mm`	float	No	Minimum track width in millimeters	`0.228`
`pcb_design_context.via_type`	string	No	Via type used on the board	`through_hole`
`pcb_design_context.component_density_per_cm2`	float	No	Component density per cm²	`13.03`
`pcb_design_context.thermal_mass_category`	string	No	Thermal mass category	`high`
Machine
`machine_context.machine_id`	string	Yes	Internal machine ID	`MACH-092`
`machine_context.machine_identifier`	GUID	Yes	Unique machine identifier	`65ce02f7-c72f-43ad-8b36-d780f234dbb2`
`machine_context.machine_name`	string	Yes	Commercial machine name or model	`Asymtek`
`machine_context.machine_type`	string	Yes	Machine or stage type	`reflow_oven`
`machine_context.serial_number`	string	No	Machine serial number	`MSN-730739`
Component
`component_context.component_category`	string	No	Component category	`resistor`
`component_context.package_type`	string	No	Component package	`QFN-32`
`component_context.pin_count`	int	No	Pin count	`32`
`component_context.msl_level`	string	No	Moisture sensitivity level	`MSL2`
`component_context.component_ref_hash`	string	No	Anonymized component reference	`ref_43be556f9a6a658d`
`component_context.manufacturer_part_number`	string/null	No	Manufacturer part number if available	`MPN-656820-SOT-23`
`component_context.component_age_days`	int	No	Component age in days	`505`
`component_context.polarity_sensitive`	boolean	No	Polarity sensitivity	`true`
Materials
`material_context.solder_alloy`	string	No	Solder alloy	`BiSn`
`material_context.solder_paste_type`	string	No	Solder paste type	`water_soluble`
`material_context.flux_type`	string	No	Flux type	`ORL0`
`material_context.paste_lot_age_days`	int	No	Paste lot age in days	`50`
`material_context.paste_storage_compliant`	boolean	No	Storage compliance	`true`
`material_context.paste_floor_life_minutes`	int	No	Paste floor life	`240`
Recipe and parameters
`recipe_context.recipe_id`	GUID	No	Recipe identifier	`9b75d928-f928-43c0-9c11-e3e6ccdc4a00`
`recipe_context.reference_variable_code`	string	No	Recipe reference variable	`SOLDER_PASTE`
`recipe_context.recipe_rows[].variable_code`	string	No	Recipe parameter code	`PRINT_SPEED`
`recipe_context.recipe_rows[].target_value`	float	No	Parameter target value	`22.69`
`recipe_context.recipe_rows[].out_of_tolerance_flag`	boolean	No	Indicates whether it was out of tolerance	`false`
`recipe_context.recipe_rows[].deviation_from_target_pct`	float	No	Percentage deviation from target	`1.41`
Test, defect and root cause
`test_and_defect_classification.test_stage`	string	No	Test or inspection stage	`FCT`
`test_and_defect_classification.test_result`	string	No	Test result	`FAIL`
`test_and_defect_classification.defect_category`	string/null	No	Detected defect category	`soldering`
`test_and_defect_classification.defect_code`	string/null	No	Specific defect code	`OPEN_JOINT`
`test_and_defect_classification.root_cause_category`	string	No	Root cause category	`machine`
`test_and_defect_classification.corrective_action`	string/null	No	Recommended corrective action	`Validate component coplanarity`
Quality and KPIs
`quality_and_kpi.first_pass_yield_flag`	boolean	Yes	Indicates whether it passed on first pass	`false`
`quality_and_kpi.rework_required`	boolean	Yes	Indicates whether rework is required	`true`
`quality_and_kpi.scrapped`	boolean	Yes	Indicates whether the unit was scrapped	`true`
`quality_and_kpi.cycle_time_s`	float	No	Cycle time in seconds	`1442.01`
`quality_and_kpi.downtime_minutes`	float	No	Downtime in minutes	`57.84`
Lineage
`lineage.source_collection`	string	Yes	Source collection of the record	`materials`
`lineage.transformation_pipeline_id`	string	Yes	Associated transformation pipeline	`PIPE-016`
`lineage.derived_products`	string[]	No	Derived data products	`["BACKX.PCBFailureDiagnostics.Restricted.v1"]`
Data quality
`data_quality.completeness_pct`	float	Yes	Record completeness percentage	`95.02`
`data_quality.consistency_pct`	float	Yes	Consistency percentage	`99.5`
`data_quality.duplicate_flag`	boolean	Yes	Marked as duplicate	`false`
`data_quality.freshness_seconds`	int	Yes	Data age in seconds	`40445`
Data governance
`data_governance.privacy_level`	string	Yes	Privacy level	`raw_sensitive`
`data_governance.visibility`	string	Yes	Allowed data visibility	`private_internal`
`data_governance.retention_period_days`	int	Yes	Retention in days	`1825`
`data_governance.external_distribution_allowed`	boolean	Yes	External distribution allowed	`false`

Field	Type	Req.	Description	Example
Identification
`record_id`	string	Yes	Unique diagnostic record identifier	`RST-00000001`
`data_product_name`	string	Yes	Data product name	`BACKX.PCBFailureDiagnostics.Restricted.v1`
`schema_version`	string	Yes	Schema version	`1.0.0`
Anonymized traceability
`traceability.production_batch_id_hash`	string	Yes	Hashed production batch	`batch_ae93ed90224265a4`
`traceability.line_id_hash`	string	Yes	Hashed line	`line_1e6db5ce68abf10e`
`traceability.machine_line_id_hash`	string	Yes	Hashed machine/line	`mline_321e02fc849e1a37`
`traceability.machine_type`	string	Yes	Machine or station type	`printer`
`traceability.production_timestamp`	DateTime	Yes	Associated production moment	`2025-05-30T22:02:26Z`
PCB
`pcb_context.board_type`	string	Yes	Physical board type	`rigid`
`pcb_context.layer_count`	int	Yes	Number of layers	`4`
`pcb_context.surface_finish`	string	Yes	Surface finish	`HASL`
`pcb_context.min_track_width_mm`	float	No	Minimum track width	`0.079`
`pcb_context.via_type`	string	No	Via type	`blind`
`pcb_context.component_density_per_cm2`	float	No	Component density per cm²	`4.6`
`pcb_context.thermal_mass_category`	string	No	Thermal mass category	`high`
BOM
`bom_context.total_component_count`	int	Yes	Total components in the BOM	`753`
`bom_context.unique_component_count`	int	Yes	Number of unique components	`166`
`bom_context.high_risk_component_count`	int	Yes	High-risk components	`32`
Component
`component_context.component_category`	string	No	Component category	`dfn`
`component_context.package_type`	string	No	Package	`BGA-144`
`component_context.msl_level`	string	No	MSL level	`MSL4`
`component_context.component_ref_hash`	string	Yes	Anonymized component reference	`ref_00b71767ea09cbff`
`component_context.supplier_id_hash`	string	Yes	Anonymized supplier	`supplier_a669fde50a56b611`
`component_context.component_lot_id_hash`	string	Yes	Anonymized component lot	`clot_e1243d9a4539d970`
`component_context.component_age_days`	int	No	Component age in days	`367`
Materials
`material_context.solder_alloy`	string	Yes	Solder alloy	`BiSn`
`material_context.solder_paste_type`	string	Yes	Paste type	`water_soluble`
`material_context.flux_type`	string	No	Flux type	`REL0`
`material_context.paste_storage_compliant`	boolean	No	Paste storage compliance	`true`
`material_context.cleaning_process`	string	No	Cleaning process	`solvent`
Process — Printing
`process_measurements.printing.stencil_thickness_um`	int	No	Stencil thickness in microns	`120`
`process_measurements.printing.aperture_area_ratio`	float	No	Aperture area ratio	`0.863`
`process_measurements.printing.paste_deposit_volume_pct`	float	No	Paste deposit volume	`75.57`
`process_measurements.printing.paste_deposit_offset_um`	float	No	Deposit offset in microns	`41.8`
`process_measurements.printing.print_speed_mm_s`	float	No	Print speed in mm/s	`39.2`
`process_measurements.printing.squeegee_pressure_n`	float	No	Squeegee pressure in newtons	`91.6`
Process — Placement
`process_measurements.placement.x_offset_um`	float	No	Placement X offset in microns	`42.2`
`process_measurements.placement.y_offset_um`	float	No	Placement Y offset in microns	`48.6`
`process_measurements.placement.rotation_offset_deg`	float	No	Angular offset in degrees	`0.67`
`process_measurements.placement.placement_force_n`	float	No	Placement force	`5.83`
`process_measurements.placement.component_polarity_checked`	boolean	No	Polarity verification	`true`
Process — Reflow
`process_measurements.reflow.peak_temp_c`	float	Yes	Profile peak temperature	`248.3`
`process_measurements.reflow.measured_component_peak_temp_c`	float	No	Measured component peak temperature	`244.4`
`process_measurements.reflow.time_above_liquidus_s`	float	Yes	Time above liquidus in seconds	`63.1`
`process_measurements.reflow.soak_time_s`	float	No	Soak time in seconds	`49.5`
`process_measurements.reflow.preheat_ramp_c_s`	float	No	Preheat ramp in °C/s	`1.48`
`process_measurements.reflow.cooling_rate_c_s`	float	No	Cooling rate in °C/s	`2.73`
`process_measurements.reflow.conveyor_speed_cm_min`	float	No	Conveyor speed in cm/min	`103.3`
`process_measurements.reflow.oxygen_ppm`	float/null	No	Oxygen in ppm	`4108.0`
`process_measurements.reflow.nitrogen_used`	boolean	No	Nitrogen used	`false`
Inspection / test result
`inspection_test_result.inspection_id`	string	Yes	Inspection ID	`INS-202475079`
`inspection_test_result.test_stage`	string	Yes	Test stage	`AOI_post_reflow`
`inspection_test_result.test_result`	string	Yes	Test result	`FAIL`
`inspection_test_result.inspection_errors_count`	int	Yes	Number of detected errors	`3`
`inspection_test_result.failure_signature`	string	No	Failure signature or pattern	`no_power`
`inspection_test_result.error_message_raw`	string/null	No	Raw error message	`Detected MISSING_COMPONENT`
Failure analysis
`failure_analysis.defect_category`	string	Yes	Defect category	`placement`
`failure_analysis.defect_code`	string	Yes	Defect code	`MISSING_COMPONENT`
`failure_analysis.defect_severity`	string	Yes	Defect severity	`critical`
`failure_analysis.root_cause_category`	string	Yes	Root cause category	`machine`
`failure_analysis.root_cause_confidence`	float	Yes	Root-cause confidence (0–1)	`0.742`
`failure_analysis.corrective_action`	string	No	Recommended corrective action	`Check feeder, nozzle...`
`failure_analysis.rework_required`	boolean	Yes	Requires rework	`false`
`failure_analysis.scrapped`	boolean	Yes	Unit scrapped	`false`
`failure_analysis.estimated_cost_impact_eur`	float	No	Estimated economic impact in euros	`262.18`
Data governance
`data_governance.privacy_level`	string	Yes	Privacy level	`pseudonymized`
`data_governance.visibility`	string	Yes	Dataset visibility	`restricted`
`data_governance.contract_required`	boolean	Yes	Requires an active contract	`true`
`data_governance.redistribution_allowed`	boolean	Yes	Redistribution allowed	`false`

Field	Type	Req.	Description	Example
Identification and aggregation
`record_id`	string	Yes	Unique record identifier aggregated	`AGG-00000001`
`data_product_name`	string	Yes	Data product name	`BACKX.PCBFailurePatterns.Aggregated.v1`
`schema_version`	string	Yes	Schema version	`1.0.0`
`aggregation_level`	string	Yes	Aggregation level or criterion	`defect_pattern`
Production period
`production_period.period_type`	string	Yes	Temporal window type	`monthly`
`production_period.period_start`	date	Yes	Aggregated period start	`2025-12-15`
`production_period.period_end`	date	Yes	Aggregated period end	`2026-01-14`
Aggregated source
`source_context.manufacturer_type`	string	Yes	Source manufacturer type	`pcb_assembler`
`source_context.plant_region`	string	Yes	Plant region	`EU`
`source_context.process_tracker_source`	boolean	Yes	Comes from ProcessTracker	`true`
PCB
`pcb_context.product_family`	string	Yes	Product family	`automotive`
`pcb_context.board_type`	string	Yes	Board type	`flex`
`pcb_context.layer_count`	int	Yes	Number of layers	`10`
`pcb_context.surface_finish`	string	Yes	Surface finish	`ImmersionTin`
`pcb_context.via_type`	string	Yes	Via type	`via_in_pad`
`pcb_context.component_density_per_cm2`	float	Yes	Component density	`6.76`
`pcb_context.thermal_mass_category`	string	Yes	Thermal mass category	`medium`
Component
`component_context.component_category`	string	Yes	Component category	`sot`
`component_context.package_type`	string	Yes	Package	`TQFP-64`
`component_context.pin_count`	int	Yes	Pin count	`64`
`component_context.msl_level`	string	Yes	MSL level	`MSL3`
`component_context.component_family_hash`	string	Yes	Anonymized component family	`cfam_eedb824916dd6525`
Materials
`material_context.solder_alloy`	string	Yes	Solder alloy	`SnPb`
`material_context.solder_paste_type`	string	Yes	Paste type	`halogen_free`
`material_context.powder_size_type`	string	Yes	Powder size/type	`Type3`
`material_context.flux_type`	string	Yes	Flux type	`ROL1`
`material_context.cleaning_process`	string	Yes	Cleaning process	`solvent`
Process
`process_context.process_stage`	string	Yes	Aggregated process stage	`pick_and_place`
`process_context.stencil_thickness_um`	int	No	Stencil thickness	`80`
`process_context.peak_temp_c`	float	No	Peak temperature	`228.8`
`process_context.time_above_liquidus_s`	float	No	Time above liquidus	`85.8`
`process_context.soak_time_s`	float	No	Soak time	`129.7`
`process_context.preheat_ramp_c_s`	float	No	Preheat ramp	`1.75`
`process_context.cooling_rate_c_s`	float	No	Cooling rate	`3.69`
`process_context.oxygen_ppm`	float/null	No	Oxygen concentration	`4871.0`
`process_context.nitrogen_used`	boolean	No	Nitrogen used	`false`
Defect
`defect_context.defect_category`	string	Yes	Defect category	`soldering`
`defect_context.defect_code`	string	Yes	Defect code	`COLD_JOINT`
`defect_context.defect_severity`	string	Yes	Defect severity	`high`
`defect_context.test_stage`	string	Yes	Stage in which it was detected	`ICT`
Quality metrics
`quality_metrics.units_processed`	int	Yes	Units processed in the group (min. 50)	`1719`
`quality_metrics.units_failed`	int	Yes	Failed units	`112`
`quality_metrics.sample_size`	int	Yes	Sample size	`1719`
`quality_metrics.failure_rate_pct`	float	Yes	Failure rate percentage	`6.526`
`quality_metrics.baseline_failure_rate_pct`	float	Yes	Baseline failure rate for comparison	`2.621`
`quality_metrics.risk_multiplier`	float	Yes	Risk multiplier against baseline	`2.49`
`quality_metrics.first_pass_yield_pct`	float	Yes	First pass yield percentage	`93.474`
`quality_metrics.rework_rate_pct`	float	Yes	Rework rate	`4.524`
`quality_metrics.scrap_rate_pct`	float	Yes	Scrap rate	`2.537`
`quality_metrics.confidence_level`	string	Yes	Pattern confidence level	`medium`
Recommendation
`recommendation.risk_score`	float	Yes	Pattern risk score (0–100)	`77.71`
`recommendation.avoid_combination_flag`	boolean	Yes	Indicates whether this combination should be avoided	`false`
`recommendation.recommended_action`	string	Yes	Recommended action	`Increase thermal energy or adjust time above liquidus.`
`recommendation.applicable_conditions`	string	No	Conditions under which it applies	`Applicable to SMT processes with similar parameters.`
Data governance
`data_governance.privacy_level`	string	Yes	Privacy level	`aggregated_anonymized`
`data_governance.visibility`	string	Yes	Data product visibility	`public_catalog_restricted_access`
`data_governance.license_type`	string	Yes	License type	`commercial_use_only`
`data_governance.redistribution_allowed`	boolean	Yes	Redistribution allowed	`false`
`data_governance.minimum_aggregation_threshold`	int	Yes	Minimum aggregation threshold	`50`

Field	Type	Req.	Description	Example
Service identification
`id`	string	Yes	Unique AI service identifier	`pcb-smt-defect-risk-ai-service-v1`
`name`	string	Yes	Functional name of the published service	`PCB SMT Defect Risk Prediction & Scenario Optimization Service`
`version`	semver	Yes	Semantic version of the service	`1.0.0`
`type`	enum	Yes	Functional asset type	`AI_INFERENCE_SERVICE`
`provider`	string	Yes	Provider participant identifier	`<participant-id>`
`domain`	string	Yes	Industrial domain of the service	`electronics-manufacturing`
`process_area`	string	Yes	Process area covered by the service	`SMT / PCB Assembly`
API operations
`operations.predict.method`	HTTP method	Yes	Method for single prediction	`POST`
`operations.predict.path`	string	Yes	Path for single-scenario inference	`/predict`
`operations.predictBatch.path`	string	Yes	Path for batch inference or risk ranking	`/predict/batch`
`operations.predictBatch.input`	array	Yes	Supported input formats for batch execution	`application/json, text/csv`
`operations.scenarioComparison`	operation	Yes	Before/after comparison using variants submitted as a batch	`delta risk_score vs base`
Supported input
`refdes`	string	No	Component reference designator	`U17`
`lot_id`	string	No	Production lot identifier	`LOT-2026-042`
`package_type`	string	Yes	SMT package type	`QFN`
`component_category`	string	No	Functional component category	`microcontroller`
`msl_level`	string/int	No	Moisture sensitivity level	`3`
`pitch_mm`	float	Yes	Distance between pins or pads in millimeters	`0.50`
`thermal_pad`	boolean	No	Whether the component has a thermal pad	`true`
`time_above_liquidus_s`	float	Yes	Time above liquidus in seconds	`63.5`
`peak_temp_c`	float	Yes	Reflow peak temperature	`243.0`
`aperture_reduction_pct`	float	No	Stencil aperture reduction percentage	`12.0`
`paste_deposit_volume_pct`	float	No	Solder-paste deposit volume against target	`96.5`
`x_offset_um`	float	No	Placement offset on X axis	`18.0`
`y_offset_um`	float	No	Placement offset on Y axis	`-12.0`
`rotation_offset_deg`	float	No	Component angular deviation	`0.35`
`component_context.package_type`	string	No	Alternative path for package type in nested payloads	`BGA`
`process_measurements.reflow.time_above_liquidus_s`	float	No	Nested path for reflow measurement	`58.0`
Inference outputs
`risk_score`	float	Yes	Normalized risk score	`82.4`
`risk_level`	enum	Yes	Operational risk level	`high`
`failure_probability`	float	Yes	Estimated failure probability	`0.184`
`estimated_failure_rate`	float	No	Estimated failure rate for the evaluated group	`7.8`
`most_likely_defect`	string	No	Most likely defect according to the model	`insufficient solder`
`most_likely_root_cause`	string	No	Most likely root cause	`low paste volume + high offset`
`risk_drivers`	array	No	Technical drivers increasing risk	`["paste_deposit_volume_pct", "x_offset_um"]`
`recommended_actions`	array	No	Recommended operational actions by responsible area	`["Review stencil", "Adjust pick & place"]`
`similar_historical_patterns`	array	No	Similar anonymized historical patterns	`[{"pattern_id":"PAT-018"}]`
Derived by consumer UI
`natural_language_explanation`	derived	No	Natural-language explanation generated by the consumer interface	`High risk due to offset and low paste volume`
`prioritized_operational_checklist`	derived	No	Prioritized checklist for operations or quality	`1. Stencil 2. Reflow 3. AOI`
`before_after_delta_view`	derived	No	Comparative delta view against the baseline scenario	`risk_score -14.2`
`csv_export_ranking`	derived	No	Batch ranking export	`ranking.csv`
Data protection and EDC
`data_protection.personal_data`	boolean	Yes	Whether personal data is processed	`false`
`data_protection.production_sensitive_data`	boolean	Yes	Whether the data is production-sensitive	`true`
`data_protection.historical_patterns_anonymized`	boolean	Yes	Historical patterns returned without sensitive identifiers	`true`
`data_protection.plant_region_anonymization`	enum	Yes	Plant/region anonymization requirement	`required`
`edc.asset_id`	string	Yes	EDC asset identifier	`pcb-smt-defect-risk-ai-service-v1`
`edc.asset_type`	string	Yes	Asset type in Eclipse EDC	`HttpData`
`edc.transfer_type`	string	Yes	EDC transfer type	`HttpData-PULL`
`edc.contract_definition_id`	string	Yes	Contract definition associated with the service	`contractdef-pcb-smt-defect-risk-ai-service-v1`
`edc.frontend_edr_exposure`	enum	Yes	EDR exposure control in the frontend	`forbidden`

Lineage explorer

Data traceability

BACK-X records data lineage from ingestion to materialization as data products, enabling audits and impact analysis.

SRC

MSTECH equipment Asymtek, Pemtron, Ovens, Loaders ProcessTracker vX.Y

↓ Ingestion · Eclipse EDC Connector (EDC_MSTECH → EDC_BACKX)

RAW

BACK-X raw data MongoDB collections: lines, recipes, events… ingestion_timestamp registrado

EDC

Enrichment Resolution of machine_type, line_name and part_number JOIN lines + machines + customer_products

↓ Transformation · Quality validation (completeness, uniqueness, consistency)

BACKX.LineMachineEvents.v1 Data product published in the catalog version_schema = v1 · DCAT-AP metadata

↓ Access · ODRL contract negotiated via Eclipse EDC

APP

UC3M / DAIMA AI/ML models · Predictive analytics Use: internal consortium analytics

USR

Dashboard BACK-X OEE · KPIs · Status lines Vista agregada · Herramientas internas

Each transformation is recorded in the Clearing House (under implementation) with a timestamp, the participant that executed it, the input/output schema version and a reference to the active EDC contract.

Technical architecture

Eclipse EDC in BACK-X

EDC

EDC_BACKX

Central Eclipse EDC connector operated by ONIZEA. Acts as the contract-negotiation hub for the main BACK-X node.

ODRL

EDC_MSTECH

MSTECH Eclipse EDC connector. Manages publication and transfer of plant data from MES systems to the BACK-X node.

DSP

EDC_UC3M

UC3M Eclipse EDC connector. Allows UC3M to act as Data Consumer for data products and as Service Provider publishing AI model results.

API

ODRL Policies

The usage conditions for each data product are translated into ODRL policies automatically enforced by the EDC connector during contract negotiation.

IAM

Dataspace Protocol (DSP)

BACK-X adopts the Dataspace Protocol for contract negotiation and data transfer, ensuring interoperability with other European industrial data spaces.

LOG

OAuth2 / OIDC

EDC connectors are registered as OAuth2 clients in the BACK-X IdP and use the client credentials flow for node-to-node authentication during contract negotiation.